From pioneering thinwall cup molds in the 1950s to introducing stack molds in the 1960s, Husky has continuously led the way in advancing packaging molding technology. Today, the company’s HyLECTRIC® and HyPERSYNC™ molding platforms represent an evolution of this legacy, delivering unmatched performance, precision, and efficiency for brands and producers facing rising operational costs, sustainability mandates, and increasingly complex production requirements.
Integrated Melt Delivery Systems Built for Today’s and Tomorrow’s Needs
The HyLECTRIC® and HyPERSYNC™ platforms function as fully integrated melt delivery systems, seamlessly combining injection molding machines with purpose-built Husky hot runners and mold controllers. This holistic approach to the control of plastic melt on the complete journey, from the hopper to the mold, ensures best possible part quality, highest performance levels and minimum material waste while supporting the widest possible processing window.
Building on this integrated foundation, each platform delivers distinct advantages for specific production needs. The molding platform is recognized as the best-in-class standard in packaging molding, offering superior productivity, versatility, and ease of use. Its distinctive three-platen clamping unit features Reflex™ platens that provide uniform clamp force distribution across the entire molding surface, ensuring part-to-part consistency and extending tool life. Wide tie-bar spacing and robust clamp bases enable the system to run heavy, high-cavitation molds that would typically require larger conventional machines, while flexible interface options and Industry 4.0 connectivity make it the heart of truly integrated system solutions.
The recently introduced HyLECTRIC® 6 represents the next generation of the product line, featuring reduced non-process times, improved energy consumption, and increased uptime resulting from Advantage+Elite™ monitoring capabilities. The HyPERSYNC™ molding platform delivers unmatched performance, energy efficiency and reliability for thinwall food packaging, specialty closures, medical and personal care applications. Energy saving technologies, including electric mold stroke, electric clamp lock, energy recovery and speed-variable servo pumps, significantly decrease energy consumption without compromising performance.
Design Engineering Expertise and Proven Performance for Demanding Packaging Applications
The HyLECTRIC® and HyPERSYNC™ molding platforms excel across diverse packaging applications, including thinwall food containers and lids with in-mold labelling, pails, specialty closures, and sustainable packaging made from recycled and bio-based materials.
Drawing on more than 70 years of packaging innovation, Husky’s proven HyLECTRIC® and HyPERSYNC™ product lines deliver the performance, flexibility, and efficiency needed to succeed.
Both platforms support stack mold configurations, effectively doubling output without increasing footprint, which is ideal for projects with high-volume requirements. Optimized screw geometry and material selection, as well as specialized high-wear-resistant treatment of melt stream components enable efficient processing of recycled and bio-based resins, enabling molders to produce more sustainable packaging.
Elevating system capability even further is the integration of Husky’s proven Advantage+Elite™ remote monitoring service. By continuously tracking more than 70 performance parameters in real time, the service delivers proactive, data‑driven insights that maximize efficiency, enhance reliability, and optimize overall system performance and availability management.
Learn more about the next-generation packaging systems
Next-Generation Packaging Systems
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